|
Publications and Scientific Activities
|
| Peer-Reviewed Publications |
| 1 |
Chen, J.P.; Han, K. and Kalu, P.N., 3D Stress-Strain Model of the Nb3Sn Wire, IEEE Trans. Appl. Supercond., 21 (3), 2509-2512 (2011) |
| 2 |
Chen, H.H.; Kalu, P.N. and Kalu, E.E., CuInSe2 thin-film deposition on flexible plastic substrate: electrolyte recirculation rate and deposition potential effects, J. Solid State Electrochemistry, 14 (6), 1013-1020 (2010) |
| 3 |
Downey, S. II; Han, K.,; Kalu, P.N.; Yang, K. and Du, Z.M., A Study of Submicron Grain Boundary Precipitatesin Ultralow Carbon 316LN Steels, Metall. Mater. Trans. A, 41 (4), 881-887 (2010) [read online] |
| 4 |
Han, K.; Xin, Y.; Walsh, R.P.; Downey, S. and Kalu, P.N., The effects of grain boundary precipitates on cryogenic properties of aged 316-type stainless steels, Materials Science and Engineering A - Structural Materials: Properties, Microstructure and Processing, 516, 169-179 (2009) [read online] |
| 5 |
Davy, C.A.; Han, K.; Kalu, P.N. and Bole, S.T., Examinations of Cu-Ag composite conductors in sheet forms, IEEE Trans. Appl. Supercond., 18 (2), 560 (2008) [read online] |
| 6 |
Downey, S.; Kalu, P.N. and Han, K., The effect of heat treatment on the microstructure stability of modified 316LN stainless steel, Materials Science and Engineering A - Structural Materials: Properties, Microstructure and Processing, 480 (1-2), 96-100 (2008) |
| 7 |
Chen, J.; Han, K.; Kalu, P.N. and Markiewicz, W.D., Dispersion Strengthened Nb3Sn Wire, IEEE Trans. Appl. Supercond., 17 (2), 2584 (2007) [read online] |
| 8 |
Downey, S.T.; Bembridge, N.; Kalu, P.N.; Miller, H.M.; Rohrer, G.S. and Han, K., Grain boundary plane distributions in modified 316 LN steel exposed at elevated and cryogenic temperatures, J. Materials Science, 42 (23), 9543-9547 (2007) |
| 9 |
Han, K.; Chen, J.P.; Cui, B.Z.; Davy, C.A. and Kalu, P.K., Selected Composites for High Field Magnets (invited paper), Proc. MRS: Processing-Structure-Mechanical Property Relations in Composite Materials, 1, 0977-FF02-01 (2007) [read online] |
| 10 |
Kalu, P. and Waryoba, D.R., Texture and Microstructure Variation in Severe Plastic Deformed OFHC Cu Wires, Materials Science Forum, 550, 509-514 (2007) |
| 11 |
Kalu, P.N. and Waryoba, D.R., A JMAK-microhardness model for quantifying the kinetics of restoration mechanisms in inhomogeneous microstructure, Materials Science and Engineering, A464, 68-75 (2007) |
| 12 |
Shen, T.D.; Zhang, X.; Han, K.; Davy, C.A.; Aujla, D.; Kalu, P.N. and Schwarz, R.B., Structure and properties of bulk nanostructured alloys synthesized by flux-melting, J. Materials Science, 42 (5), 1638-1648 (2007) [read online] |
| 13 |
Waryoba, D.R. and Kalu, P.N., Recrystallization Behavior of ECAE Processed OFHC Copper, Microscopy & Microanalysis, 12 (2), 1040 (2006) |
| 14 |
Waryoba, D.R. and Kalu, P.N., Texture development in oxygen free high conductivity copper deformed by equal channel angular extrusion, Scanning, 28 (2), 121 (2006) |
| 15 |
Chen, J.; Han, K.; Kalu, P.N. and Markiewicz, W.D., Deformation behavior of Nb3Sn type superconductors, IEEE Trans. Appl. Supercond., 15 (2), 3568 - 3571 (2005) [read online] |
| 16 |
Davy, C.A.; Kalu, P.N.; Shen, T.D.; Alexander, D.J.; Schwarz, R.B. and Han, K., Fabrication and Characterization of Nanostructured CuAg (Ag-40at%Cu), Microscopy & Microanalysis, 11 (Suppl. 2), 1718-1719 (2005) [read online] |
| 17 |
Waryoba, D.R. and Kalu, P.N., The Effect of Homogenization on the Microtexture of Drawn OFHC Copper, Microscopy & Microanalysis, 11 (2), 1694 (2005) |
| 18 |
Waryoba, D.R. and Kalu, P.N., Textural Inhomogeneities in Drawn and Annealed OFHC Copper Wire, Extraction and Processing Division (EPD) Congress, 2005, 247-258 (2005) |
| 19 |
Waryoba, D.R. and Kalu, P.N., The Effect of Homogenization on the Microstructure of Drawn OFHC Copper, Scanning, 27, 102 (2005) |
| 20 |
Waryoba, D.R. and Kalu, P.N., Textural and Microstructural Inhomogeneities in Drawn and Annealed OFHC Copper Wire, Materials Science Forum, 495-497, 895-900 (2005) [read online] |
| 21 |
Waryoba, D.R. and Kalu, P.N., Deformation and Recrystallization Texture of Heavily Drawn OFHC Copper, Materials Science Forum, 495-497, 877-882 (2005) [read online] |
| 22 |
Waryoba, D.R.; Kalu, P.N. and Rollett, A.D., The Role of Orientation pinning in Statically Recrystallized OFHC Copper Wire, Metall. Mater. Trans. A, 36A (1), 205-215 (2005) [read online] |
| 23 |
Ludtka, G.M.; Jaramillo, R.A.; Kisner, R.A.; Nicholson, D.M.; Wilgen, J.B.; Mackiewicz-Ludtka, G. and Kalu, P.N., In situ evidence of enhanced transformation kinetics in a medium carbon steel due to a high magnetic field, Scripta Mater., 51, 171-174 (2004) |
| 24 |
Waryoba, D.R. and Kalu, P.N., Effect of Annealing Temperature on the Development of Twin Boundaries, The Minerals, Metals & Materials Society (TMS) Letters, 1 (4), 71 (2004) [read online] |
| 25 |
Han, K.; Vasquez, A.A.; Xin, Y. and Kalu, P.N., Microstructure and tensile properties of nanostructured Cu-25wt%Ag, Acta Mater., 51 (3), 767-780 (2003) [read online] |
| 26 |
Waryoba, D.R. and Kalu, P.N., Quantification of Recrystallization Kinetics in Heavily Drawn OFHC Copper wire by Microhardness Technique, IMECE, The American Society of Mechanical Engineers, 3, 42251 (2003) [read online] |
| 27 |
Waryoba, D.R. and Kalu, P.N., Orientation Imaging Microscopy: Sample Preparation for Heavily Drawn Copper wires, Microscopy & Microanalysis, 9, 84 (2003) |
| 28 |
Iskandar, Reyes, D.; Gaxiola, Y.; Fudge, E.; Foyos, J.; Lee, E.W.; Kalu, P.; Garmestani, H. and Es-Said, O.S., The Effect of Varying the Solution Treatment Temperature, Natural Aging Treatment and Artificial Aging Treatment on the Mechanical Strength of 7249 Aluminum Alloy, Materials Science Forum, 396-402, 1121-1126 (2002) |
| 29 |
Waryoba, D.R. and Kalu, P.N., Static Recrystallization of Heavily Drawn OFHC Copper Wire at Low Annealing Temperature, Processing and Fabrication of Advanced Materials, XI, 389-402 (2002) |
| 30 |
Xin, Y.; Han, K.; Mateeva, N.; Garmestani, H.; Kalu, P.N. and Dahmen, K.H., Microstructures of La1-xAx(A=Ca or Sr) MnO3 Thin Films by Liquid-Delivery Metalorganic Chemical Vapor Deposition, J. Mater. Res., 16 (11), 3073 (2001) |
| 31 |
Kalu, P.N.; Van Sciver, S.W.; Brandao, L. and Azeredo, V., Low Cost Drilled Billet Production Method for Cu-Nb Composite Wire, IEEE Trans. Appl. Supercond., 10 (1), 1288-1291 (2000) |
| 32 |
Kalu, P.N.; Waryoba, D.R.; Van Sciver, S.W. and Brandao, L., Restoration Mechanisms in Highly Deformed Cu-based Conductor Wires, IEEE Trans. Appl. Supercond., 10 (1), 1296-1299 (2000) |
| Presentations, Posters & Abstracts |
| 1 |
Han, K.; Aujla, D.C.; Davy, A.; Kalu, P.N.; Schwarz, R.B.; Shen,T.D.; Zhang, X.; Vasquez, A.A.; Wang, E.G.; Xin, Y. and Zhang, L., Examination of Microstructure of Solidified Cu-Ag Composite by TEM and Other (invited talk), Symposium of Solidification Science and Technology, Shanghai, China, June 4-6 (2012) |
| 2 |
Lu, J.; Downey, S.T.; Goddard, R.; Han, K.; Kalu, P.N.; Toplosky, V.J.; Walsh, R.P. and Xin, Y., Comparison and Understanding of Cryogenic Properties of 316LN and MP35N, Cryogenic Engineering and Int. Cryogenic Materials Conf., Tucson, AZ, June 28-July 02 (2009) |
| 3 |
Aujla, D.K.; Davy, C.A.; Kalu, P.N.; Han, K.; Shen, T.D.; Alexander, D.J. and Schwarz, R.B., Influence of Processing Mode on the Nanostructure Development of Flux Melted Ag-40at%Cu Alloy, TMS 2008 Annual Meeting & Exhibition, New Orleans, LA, March 9-13 (2008) |
| 4 |
Davy, C.A.; Han, K.; Kalu, P.N. and Bole, S.T., Examinations of Cu-Ag composite conductors in sheet forms (poster), MT 20 - 20th Int. Conf. on Magnet Technology, Philadelphia, PA, August 27-31 (2007) |
| 5 |
Dozier, C.; Waryoba, D.; Kalu, P.N. and Kalu, E.E., Supported Bimetallic Zerovalent Metal Nanoparticles in the Remediation of Chlorinated Organic Contaminated Water, 211th ECS Meeting, Chicago, IL, May 6-10 (2007) |
| 6 |
Kalu, P.N. and Waryoba, D.R., Texture and Microstructure Variation in Severe Plastic Deformed OFHC Cu Wires, Fundamentals of Deformation and Annealing, Symposium in Honor of Prof. F. J. Humphreys, The University of Manchester, Manchester, UK, September 5-7 (2007) |
| 7 |
Ramos, K.; Kalu, E.E.; Waryoba, D. and Kalu, P.N., Synthesis and Characterization of Polymer-Stabilized Multi-metallic Nanoparticles for Electrocatalysis, 211th ECS Meeting, Chicago, IL, May 6-10 (2007) |
| 8 |
Waryoba, D. R.; Kalu, P. N. and Crooks, R., Grain Boundary Structure in Severe Plastic Deformed OFHC Cu Wires, TMS 2007, 136th Annual Meeting & Exhibition, Orlando, FL, February 25-March 1 (2007) |
| 9 |
Waryoba, D.R.; Kalu, P.N. and Crooks, R., Annealing Behavior of Wire Drawn and ECAE Deformed OFHC Copper, TMS 2007, 136th Annual Meeting & Exhibition, Orlando, FL, February 25-March 1 (2007) |
| 10 |
Chen, J.; Han, K.; Kalu, P.N. and Markiewicz, W.D., Alumina Particle-reinforced Nb3Sn Wire, Seattle, WA, August 27-September 1 (2006) |
| 11 |
Dozier, C.; Waryoba, D.; Kalu, P. and Kalu, E.E., Designing Pd-on-Metal and Pd-on-Oxides Nanoparticle Catalysts for Chlorinated Solvents in Contaminated Water, 210th ECS Fall Meeting, Cancun, Mexico, October 29-November 3 (2006) |
| 12 |
Kalu, E.E.; Waryoba, D. and Kalu, P., Electrocatalytic Oxygen Reduction at Methanol-Tolerant Modified Electrodes, 210th ECS Fall Meeting, Cancun, Mexico, October 29-November 3 (2006) |
| 13 |
Waryoba, D.R. and Kalu, P.N., On the Development of Texture in ECAE Processed OFHC Copper, Duke Energy Center, Cincinnati, OH, October 15-19 (2006) |
| 14 |
Waryoba, D.R. and Kalu, P.N., Recrystallization of OFHC copper processed by ECAE, Microscopy and Microanalysis, Chicago, IL, July 30-August 3 (2006) |
| 15 |
Waryoba, D.R. and Kalu, P.N., Microtexture of ECAE Extruded OFHC Copper, Scanning 2006, Washington, D.C., April 25-27 (2006) |
| 16 |
Waryoba, D.R. and Kalu, P.N., Texture gradient in OFHC Copper deformed by ECAE, 13th TMS Annual Meeting and Exhibition, San Antonio, TX, March 12-16 (2006) |
| 17 |
Waryoba, D.R.; Erb, A. and Kalu, P.N., OFHC Copper Severe Plastic Deformed by Equal Channel Angular Extrusion, SECTAM XXIII - 23rd Southeastern Conf. on Theoretical and Applied Mechanics, Mayaguez, Puerto Rico, May 21-23 (2006) |
| 18 |
Bouhattate, J.; Waryoba, D.R. and Kalu, P.N., Artificial neural network modeling of the micro-plasticity in the grains of drawn and annealed OFHC copper, Int. Symposium on Plasticity 2005, Kauai, HI, January 3-9 (2005) |
| 19 |
Bouhattate, J.; Waryoba, D.R. and Kalu, P.N., Prediction of the Microstructure Parameters of Heavily Deformed OFHC Copper Using Artificial Neural Network, 134th TMS Annual Meeting & Exhibition, San Francisco, CA, February 13-17 (2005) |
| 20 |
Davy, C.A.; Kalu, P.N.; Shen, T.D.; Alexander, D.J.; Schwarz, R.B. and Han, K., Fabrication and Characterization of Nanostructured CuAg (Ag-40at%Cu), Microscopy and Microanalysis, Honolulu, HI, July 31-August 4 (2005) |
| 21 |
Downey, S.; Kalu, P.N. and Han, K., The Effects of Heat Treatment on the Microstructure and Texture Evolution of Modified 316LN Stainless Steel, TMS 2005, San Francisco, CA, February 14-17 (2005) |
| 22 |
Kalu, P.N. and Waryoba, D.R., The Effect of Deformation Inhomogeneity on the Recrystallization of Severely Deformed OFHC Copper, ICCES'05 - Int. Conf. on Computational & Experimental Engineering and Sciences, Chennai, India, December 1-6 (2005) |
| 23 |
Sablin, S.S.; Waryoba, D.R. and Kalu, P.N., A 3D Monte Carlo modeling of grain growth in heavily deformed OFHC copper, Int. Symposium on Plasticity 2005, Kauai, HI, January 3-9 (2005) |
| 24 |
Waryoba, D.R. and Kalu, P.N., Textural Inhomogeneities in Drawn and Annealed OFHC Copper Wire, The 134th TMS Annual Meeting & Exhibition, San Francisco, CA, February 13-17 (2005) |
| 25 |
Waryoba, D.R. and Kalu, P.N., The Effect of Homogenization on the Microstructure of Drawn OFHC Copper, Scanning, Monterey, CA, April 5-7 (2005) |
| 26 |
Waryoba, D.R. and Kalu, P.N., Homogenization of OFHC Copper Wires, Microscopy and Microanalysis, Honolulu, HI, July 31-August 4 (2005) |
| 27 |
Waryoba, D.R. and Kalu, P.N., Effect of Annealing Temperature on the Development of Twin Boundaries, The 133rd TMS Annual Meeting & Exhibition, Charlotte, NC, March 14-18 (2004) |
| 28 |
Kalu, P.N. and Waryoba, D.R., Effect of Composition on the Recrystallization Characteristics of Weldalite X2095, 3rd Int. Conf. on Light Materials for Transportation Systems (LIMAT), Honolulu, HI, November 2-6 (2003) |
| 29 |
Waryoba, D.R. and Kalu, P.N., Quantification of Recrystallization Kinetics in Heavily Drawn OFHC Copper wire by Microhardness Technique., ASME Int. Mechanical Engineering Congress, Washington, DC, November 15-21 (2003) |
| 30 |
Waryoba, D.R. and Kalu, P.N., Evolution of Recrystallization Texture in Drawn OFHC Copper wires, The 132nd TMS Annual Meeting & Exhibition, San Diego, CA, March 2-6 (2003) |
| 31 |
Waryoba, D.R. and Kalu, P.N., Orientation Imaging Microscopy: Sample Preparation for Heavily Drawn Copper wires, The VII InterAmerican Congress on Electron Microscopy, San Antonio, TX, August 3-7 (2003) |
| 32 |
Waryoba, D.R. and Kalu, P.N., Static Recrystallization of Heavily Drawn OFHC Copper Wire at Low Annealing Temperature, 11th Int. Symposium on Processing and Fabrication of Advanced Materials, ASM Materials Solutions Conference and Exposition, Columbus, OH, October 7-10 (2002) |
| 33 |
Waryoba, D.R.; Brown, M. and Kalu, P.N., The Role of Grain Boundary Misorientation in the Recrystallization of Weldalite X2095 Alloy Plates, 13th Advanced Aerospace Materials and Processes Conference and Exposition (Aeromat), ASM International, Orlando, FL, June 10-13 (2002) |
| 34 |
Waryoba, D.R. and Kalu, P.N., The Role of Grain Orientation in the Recrystallization of Heavily Drawn OFHC Copper Wire, First Joint Int. Conf. on Recrystallization and Grain Growth, ReX-GG, Aachen, Germany, August 27-31 (2001) |
| 35 |
Kalu, P.N.; Waryoba, D.R.; Van Sciver, S. and Brandao, L., Restoration mechanisms in highly deformed Cu-based conductor wires, The 16th Int. Conf. on Magnet Technology, MT 16, Ponte Verda Beach, FL, September 26 - October 2 (1999) |
| Patents & Other Products |
| 1 |
Chen, J.; Han, K.; Kalu, P. and Markiewicz, W., "Patent: Aluminum Oxide Particle Strengthened Niobium-Tin Superconducting Composite Wire", U.S. Patent No. 8,176,620, dated May 15, 2012 (2012) |
|
|
